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Check distributor
part inventory
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| BGA Surface |
Tape Type |
Heat Sink Finish |
| Plastic |
T411 |
Black Anodize |
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| Features and Benefits |
| • | Tape mounting saves board space by eliminating mounting holes |
| • | Convenient peel and stick assembly is quick and clean |
| • | Pin Fin array allows omni-directional airflow to maximize heat dissipation |
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| Width |
Length |
Height |
Fin Thickness
Across Width |
Fin Thickness
Across Length |
Base Thickness |
# of fins
across width |
# of fins
across length |
| 35mm |
35mm |
18mm |
1.40mm |
1.57mm |
1.50mm |
10 |
10 |
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| Mechanical Outline Drawing |
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Unless otherwise shown, tolerances are ±0.38(±.015) |
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Thermal Performance
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*Natural convection thermal resistance is based on a 75 °C heat sink temperature rise.
**Forced convection thermal resistance based on an entering 1.0 m/s (200 lfm) airflow.
Due to various heat dissipation paths within a BGA device, please test the heat sink in your application. |
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This data sheet represents only one of a broad range of products we make to cool electronics. Our representatives can help you configure a complete cooling solution for your individual applications.
For more information on how to put our strengths to work for you, contact your local sales representative:
http://www.aavidthermalloy.com/sales/reps.shtml
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