Surface mount heat sink for D2 Pak (TO-263) package semiconductors. For use with Surface Mount packages.
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Product Information This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component.
Part #
Finish
RoHS
PCN
7109DG
Matte Tin Plated
Mechanical Outline Drawing
Thermal Curve
Thermal Resistance
11.00
Thermal resistance value is based on a 75°C rise in natural convection
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