Surface mount heat sink for D-Pak (TO-252) package semiconductors.
For use with Surface Mount packages.
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Product Information
This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component.
| Part # | Finish | RoHS | PCN |
| 573100D00010G | Matte Tin Plated |  |
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Mechanical Outline Drawing
Thermal Curve
| Thermal Resistance | 15.00 |
Thermal resistance value is based on a 75°C rise in natural convection
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| We offer several options for those applications which require a more unique solution. For slight modifications of this part or other attachment options, finishes, and interface materials, contact your sales associate. Challenge us with your thermal requirements - we can design custom solutions. |