Surface mount heat sink for D-Pak (TO-252) package semiconductors
Matte Tin Plated
N/A
This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component.
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We offer several options for those applications which require a more unique solution.
For slight modifications of this part or other attachment options, finishes, and interface materials, contact your local representative.
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