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New Line of BGA and ASIC High Performance Heat Sinks
» View new BGA products here
Aavid Thermalloy is pleased to offer a complete line of BGA and ASIC high performance heat sinks and their unique attachment to the electronic market sector.
The offering consists of over three hundred of maxiFLOW, Straight-fin and Pin Fin (cross cut) heat sinks and over eighty heat sinks designed for an array of unique ASICS from manufacturers such as, Freescale, IBM and others.
The heat sinks can either be taped on or attached with a patented and most effective clip-on system, maxiGRIP, on the market. All products have passed through NEBS and Milspec testing and are deployed across the electronics industry in consumer, telecomm, datacomm, biomedical and military market sectors.
These products are designed and patented by Advanced Thermal Solutions, Inc. (ATS) and offered through Aavid Thermalloy - Some of the features of these products include:
- maxiFLOW design - the best thermal performance on the market
- Low profile
- Light weight
- Tape on attachment
- Highest thermal performance heat sink per volume of space occupied
- Clip-on attachment - easy on/off - no cracking of the die - no damage to the BGA or PCB
- NEBS and Milspec approved
- Available in four different heights and covers over 17 BGA package types
- The best Cost per Thermal-Performance cooling solution on the market
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