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Attachments
heatsink attachments
Semiconductor
heatsink attachments
Kool Klips™
heatsink attachments
Thermal Clips
heatsink attachments
Female/Male Mounts
heatsink attachments
Clinch Nuts

Solderable Studs

Wave-On-Mounts
heatsink attachments
Solderable Nuts
heatsink attachments
Device Mounting Studs

Semiconductor Mounting

Semiconductor Mounting

Female and Male Mounts

Semiconductor Mounts secure the heat sinks to semiconductors via machine screws or nuts. When used with a self-feeding screw driver it is up to 10 times faster than fastening with standard nuts and bolts. They are used with most JEDEC case sizes, factory installed.

Male
 Male

Code Model Thread
04 S #6-32
05 P #4-40

Female
Female Mount

Code Model Thread Dim A
inch (mm)
Dim B
inch (mm)
Dim C
inch (mm)
Dim D
inch (mm)
01 C #6-32 0.280 (7.11) 0.187 (4.75) 0.070 (1.78) 0.108 (2.74)
02 CA #4-40 0.250 (6.35) 0.165 (4.19) 0.070 (1.78) 0.108 (2.74)
03 CM 3.0mm 0.250 (6.35) 0.166 (4.22) 0.059 (1.50) 0.097 (2.74)


Clinch Nuts

Clinch nuts are threaded nuts that allow quick assembly of the transistor to the heat sink. A single screw mounts the transistor to the heat sink, reducing your hardware requirements. Clinch nuts are permanently presses into the heat sink, and come in a variety of English and Metric threads-CNE designates an English thread, and CNM designates a Metric thread.
FIGURE A
FIGURE B
Suffix Code Thread "A" Dim "B" Dim "Figure Min mat'l thickness
CNE42 12 4-40 UNC-2B 0.96 (0.038) A 1.02 (0.040)
CNE43 NA 4-40 UNC-2B 1.37 (0.054) A 1.42 (0.056)
CNM1 13 M3 X 0.5 0.76 (0.030) 4.06 (0.160) B 0.79/0.99 (0.031/0.039)
CNM2 NA M3 X 0.5 0.96 (0.038) 4.22 (0.166) B 0.79/0.99 (0.031/0.039)
Note: Minimum recommended distance from center line of mounting hole to material edge:
4.83 (0.190) for 4-40
4.80 (0.189) for M3


Solderable Studs

 Solderable Stud
  • Solderable studs are permanently swaged into the heat sink for quick preassembly with the transistor.
  • The device is placed over the stud(s) followed by the lock washer and nut.
  • The entire component is then dropped into plated-thru holes in the PC board.
  • Test Data on Pullout
    Force (After Soldering)
    Plated-Thru
    Holes
    Non
    Plated-thru
    Holes
    Mean Pull-out Force (F) 112.7 lbs. 94.4 lbs.
    Standard Deviation (6) 11.1 lbs. 25.0 lbs.
    Sample size Tested 45 14
    Suffix Code Recommended
    Heat Sink Hole
    Diameter(s)
    mm (inches)
    Figure Length
    mm (inches)
    Thread
    Type
    SE-1 08 3.81 or 4.78
    (0.150 or .188)
    A 8.89(0.350) 6-32
    SE-2 06 3.81 or 4.78
    (0.150 or .188)
    A 12.32(0.485) 6-32
    SE-3 09 3.81 or 4.78
    (0.150 or .188)
    A 8.89(0.350) 4-40
    SE-4 14 4.78
    (0.188)
    B 8.89(0.350) 6-32
    SE-5 NA 4.78
    (0.188)
    B 12.32(0.485) 6-32
    SE-6 NA 3.48 or 3.81
    (0.137 or .150)
    A 8.89(0.350) 6-32
    SE-7* NA 4.78
    (0.188)
    B 8.89(0.350) 6-32
    SM-1 17 3.81 or 4.78
    (0.150 or .188)
    B 8.89(0.350) M3
    SM-2 NA 3.81
    (0.150)
    A 22.22(0.875) M3
    SM-3 07 3.81 or 4.78
    (0.150 or .188)
    A 8.89(0.350) M3
    SM-4* NA 4.78
    (0.188)
    B 8.89(0.350) M3
    SM-5* NA 3.81 or 4.78 A 12.32(0.485) M3
    * These studs are designed for 2.34mm (0.092”) and thicker PC boards.

    SE6 stud has nominal standoff of
    ±.25mm (0.010”) and is considered a flush
    mount.

    * Dimension and tolerance apply to
    stud only, not spacing between heat sink
    and PC board.

    Ordering Information:
    Example 12 digit part:

    Thermalloy origin part Add the three character suffix after the model number.

    a=Model Number
    c=Stud Number

    Note:
    To specify the number of solderable studs required in some models (i.e., 6060, 6061, 6072, and 6080), add the number of studs after the solderable stud suffix as follows: 6072B-SE3/1 for one stud and 6072B-SE3/2 for two studs.



    Wave-On-Mounts

    Solderable mounts can be factory installed to practically every board-mountable heat sink and flat sided extrusion. The female threaded through holes permit preassembly to the semiconductor via machine screws. This allows the heat sink/semiconductor package to be treated as one unit when fitted in PC board thru-holes for wave soldering.


    Wave-On Mounts

    Material PCB Plated Thru-hole PCB Thickness
    EA, EG .145 inch
    (3.68 mm)
    .062 inch
    (1.57 mm)
    E, EK, EL, EM, ER .187 inch
    (4.75 mm)
    .090 inch
    (2.23 mm)
    EH, EP .187 inch
    (4.75 mm)
    .090 inch
    (2.23 mm)

    Code Model
    Inches
    "A" Dim
    Inches
    "B" Dim
    Inches
    "C" Dim
    Inches
    "D" Dim
    Inches
    Threaded
    through holes
    01 E .170 .100 .100 .38 #6-32
    02 EA .135 .100 .100 .38 #4-40
    03 EG .135 .100 .045 .038 #4-40
    04 EH .170 .135 .100 .038 #6-32
    05 EK .170 .100 .0.45 .038 #6-32
    07 EM .170 .100 .100 .038 3.5MM
    08 EP .170 .135 .100 .038 3.5MM
    09 ER .170 .100 .200 .038 #6-32

    Solderable Nuts

    • Solderable nuts are permanently swaged into the heat sink for quick pre-assembly with the transistor.
    • The device is mounted to the heat sink with screws installed from the top, and the entire component is dropped into the plated-thru hole in the PC board.
    • Solderable nuts feature a closed end that prevents solder from wicking into threads and trapping contaminants or flux.

    Suffix Code Recommended
    Heat Sink
    Hole Diameter
    mm (inches)
    Thread Dim. A
    mm (inches)
    Dim. B
    mm (inches)
    Dim.C
    mm (inches)
    -SNM1 NA 3.81 or 4.78
    (0.150 or .188)
    M3x0.5 3.28(0.129) 3.56(0.140) 7.75(0.305)
    -SNE1 14 3.81 or 4.78
    (0.150 or .188)
    4-40 UNC-2B 3.28(0.129) 3.56(0.140) 7.75(0.305)
    -SNE2 13 3.81 or 4.78
    (0.150 or .188)
    6-32 UNC-2B 3.28(0.129) 3.56(0.140) 7.75(0.305)
    -SNE3 NA 3.81 or 4.78
    (0.150 or .188)
    6-32 UNC-2B 2.54(0.100) 2.54(0.100) 5.99(0.236)

    4.95mm ± .13mm (0.195” ± .005”) plated-thru hole in PC board recommended.

    Ordering Information:
    Example 12 digit part:

    Thermalloy origin part
    Add the four character suffix after the model number.
    For example:

    Note: To specify the number of solderable nuts required in some models (i.e., 6054, 6072 and 6080), add the number of nuts after the solderable nut suffix, for example, 6072B-SNE1/ 1 for one nut and 6072B-SNE1/2 for two nuts.


    Device Mounting Studs

    • Device mounting studs are available as options on certain vertical and board mount heat sinks as a time-saving aid for mounting semiconductors.
    • This option feature speeds up production assembly time and reduces hardware requirements.
    Suffix code Recommended
    Heat Sink
    Hole Diameter
    Length Thread Type
    SF1 11 3.18 or 3.81
    (0.125 or 0.150)
    7.67 (0.302) 4-40 UNC-2A
    SF2 NA 3.81(0.125) 7.75 (0.305) M3x0.5
    SF3 NA 3.48 (0.137) 7.67 (0.302) 6-32 UNC-2A
    SF4 NA 4.78 (0.188) 18.80 (0.740) 8-32 UNC-2A

    Ordering Information:
    Example 12 digit part:

    Thermalloy origin part:
    Add the three character suffix after the standard model number ordered. For Example:
    6089B-SF1 = Model Number - Device Mounting Stud
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    Aavid will lead the electronics thermal management industry worldwide. We will be the first company customers call to enable their thermal designs anywhere in the world. We will respond with extraordinary speed and will provide them with timely and cost-effective solutions because we understand their needs, their industry, and their culture. 2012 Aavid Thermalloy, LLC