Jump to Navigation
Home
Tel (toll-free): +1-855-32-AAVID

Search form

  • Home
  • Products
    • Heat Sinks By Device
      • Board Level
      • BGA
      • DC to DC Converters
      • Microprocessors
      • Electrolytic Capacitors
      • IGBT Modules
      • LED Light Sources
    • Heat Sinks By Product Line
      • North American Extrusions
      • European Extrusions
      • Max Clip System
      • Liquid Cold Plates
      • Heat Pipe Assemblies
      • Bonded Fin
      • Folded Fin
      • Forced Convection Coolers
    • Interface Materials
      • Greases
      • Gap Fillers
      • Insulating Films
      • Thin Films
      • Insulating Pads
      • Insulators
      • Thermal Adhesives
      • Tape
    • Attachment Methods
      • PC Board Mounting
      • Semiconductor
      • Tape
    • Accessories
      • Alignment Pads
      • Stanchion Pads
      • Standard Mounting Pads
      • Standard Clips
      • Card Ejectors
      • Card Guides
      • Mounting Kits
      • Shoulder Washers
      • Tape
    • Finishes
  • Solutions
    • Natural Convection
      • Stamped Heat Sinks
      • Extruded Solutions
    • Forced Convection
      • High Fin Density
      • Fan Heat Sinks
    • Fluid Phase Change
      • Small Diameter Heat Pipe
      • Large Diameter Heat Pipe
    • Liquid Cooled
      • Liquid Cold Plates
      • Extended Surface
      • Micro Channel Technology
  • Design
    • Services
    • Locations
  • Tech Tools & Docs
    • Documents
      • MSDS Safety Sheets
      • RoHS Documents
    • Papers & Presentations
      • How to Select a Heat Sink
      • Technical Papers
    • Thermal Tools
      • Flow Velocity Calculator
      • Performance Factor Table
      • Length Correction Considerations
      • Temperature Correction Considerations
      • Reading a Thermal Performance Graph
      • Thermal Resistance Tool for Bonded Fins
  • Contact
    • Sales, Service, Tech, & Design
    • Contact Form
    • Design Assistance
    • Sample Request
    • Quote Request
    • Literature Request
    • Find a Sales Associate
    • How to Place a Purchase Order
    • Authorized Distributors
  • Our Company
    • Locations
    • Management Team
    • Quality
    • Ethics
    • About Aavid
  • News & Events
Attachments
heatsink tape
Double Sided Tapes
heatsink tape
1050 / T404
heatsink tape
1070 / T405R
heatsink tape
1090/ T412

T410R / T411

Double Sided Tapes

Double Sided Tapes
Ther-a-Grip

Double-sided thermal tapes adhere the heat sink to the device and offer good thermal characteristics. They are easy to apply, require no curing time, can be electrically conductive or isolating, and need no mechanical support to provide thermal or physical contact between the device and the heat sink. Aavid can apply one side to a heat sink.

Available in a specific cut size or in a sheet size, typically 8.00" x 8.00".

Ther-A-Grip™ 1050 / T404

For ceramic or metal packages
Ther-A-Grip™ 1050 uses a 0.001 inch (0.03 mm) Kapton MT filled polymide film coated on both sides with high-bond strength, pressure-sensitive acrylic adhesive that is loaded with aluminum oxide particles. This provides both good thermal performance and excellent electrical isolation.

Color Beige
Electrical Function Insulating
Thickness 0.005 inch (0.13 mm)
Carrier Kapton
Thermal Impedance 0.58 °C-in2/w
Thermal Resistance 0.37 w/m-k
Breakdown Voltage 5570 VAC
Volume Resistivity 3 x 1014 Ohm-cm
UL Flammability 94V-O
Rating U.L.94
Lap Shear Adhesion 124 psi
Die Shear Adhesion
Aluminum 25°C
Aluminum 150°C
Alum. Oxide 25°C
Alum. Oxide 150°C
130 psi
50 psi
170 psi
50 psi
Creep Adhesion
25°C @ 12psi
150°C @ 12psi
>50 days
>10 days


Ther-A-Grip™ 1070 / T405R

For ceramic or metal packages

Ther-A-Grip™ 1070 uses a 0.002 inch (0.05 mm) aluminum foil core coated on both sides with high-bond strength, pressure-sensitive acrylic adhesive that is loaded with aluminum oxide particles. The aluminum foil provides added thermal conductivity for applications where electrical isolation is not required. The combination of filter, expanded metal and embossed surface enhances both tape conformability and thermal performance.


Ther-A-Grip 1090™ / T412

For ceramic or metal packages

Ther-A-Grip™ 1090 uses an expanded foil carrier coated on both sides with high-bond strength, presure sensitive acrylic that is loaded with titanium diboride particles. The combination of filter, expanded metal and embossed surface enhances both tape conformability and thermal performance.

Color 1070 / White 1090 / Grey
Electrical Function Conductive Conductive
Thickness 0.006 inch
(0.15 mm)
0.009 inch
(0.23 mm)
Carrier Aluminum Expanded Aluminum
Thermal Impedance 0.54 °C-in2/w 0.25 °C-in2/w
Thermal Conductivity 0.50 w/m-k 1.40 w/m-k
Breakdown Voltage N/A N/A
Volume Resistivity 3 x 10-2 Ohm-cm N/A
UL Flammability 94V-0 N/A
Rating U.L.94
Lap Shear Adhesion 134 psi 70 psi
Die Shear Adhesion
Aluminum 25°C
Aluminum 150°C
Alum.Oxide 25°C
Alum.Oxide 150°C
125 psi
55 psi
145 psi
60 psi
135 psi
25 psi
125 psi
40 psi
Creep Adhesion
25°C @ 12 psi
150°C @ 12 psi
>50 days
>10 days
>50 days
>10 days


T410R / T411


For plastic packages

T410R thermally conductive tape consists of a high bond strength, pressure sensitive acrylic adhesive loaded with aluminum oxide and coated onto a 0.002 inch (0.05mm) aluminum foil carrier. The other side of the foil carrier has a silicone pressure sensitive adhesive which provides excellent adhesion to silicone-contaminated plastics and other low energy surfaces.

T411 thermally conductive tape consists of a high bond strength, pressure sensitive adhesive with an aluminum mesh carrier layer. The mesh carrier allows the tape to conform to curved surfaces of plastic molded IC packages, providing a high adhesive strength attachment for heat sinks. The high performance silicone-contaminated plastics and other low energy surfaces.

Typical Properties T410R T411
Construction
Adhesive (to heat sink side) Acrylic Silicone
Color 0.006 inch
White
0.009 inch
Clear (Silver)
Carrier Aluminum Foil Aluminum Mesh
Adhesive (onto component side) Silicone Silicone
Color (to component side) Clear (Silver) Clear (Silver)
Thickness, mm (inch) 0.18 (0.007) 0.28 (0.011)
Thermal
Thermal Impedance @<1 psi °C-cm2/w (°C-in2/w) 7.1 (1.1) 6.5 (1.0)
Operating Temperature Range, °C -50 to + 150 -50 to + 150
Mechanical
Lap shear Adhesion, psi (MPa) 60 (0.414) 14 (0.094)
Die shear Adhesion, psi (MPa) Steel/FR4
25°C
125 °C

170 (1.172)
40 (0.276)

80 (0.552)
20 (0.138)
Check Distributor Stock
Enter a part number for
pricing and availability.
Make a Request
Design Assistance


Request a Quote


Request a Sample


Customer Assistance
Contact Us
Get Design assistance
Find a Distributor
Find a Sales Rep
Request a Quote
Placing an Order
Terms and Conditions
Returns
Popular Products
Extrusions
Board Level
Liquid Cooling
Heat Pipe Technology
Heat Sink Accessories
Interface Materials
Design Services
Advanced Thermal Engineering
Applications Engineering Support
Product Development
Design Center Locations
Useful Tech Tools
How to Select a Heat Sink
Decipher a Part Number
Performance Factor Table
Flow Velocity Calculator
Our Company
About Aavid
News and Events
Management Team
Worldwide Locations
Directions to Headquarters
Disclaimer
Customer Survey
Privacy Policy
Aavid will lead the electronics thermal management industry worldwide. We will be the first company customers call to enable their thermal designs anywhere in the world. We will respond with extraordinary speed and will provide them with timely and cost-effective solutions because we understand their needs, their industry, and their culture. 2012 Aavid Thermalloy, LLC