Interface Materials
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Thermalfilm, Thermalfilm MT. Low cost polymide plastic insulating films designed to be an improved replacement for mica. Radiation resistant, no melting points, no known organic solvents. |
Insulating covers, Bushings, Aluminum Oxide Ceramic, Hard Anodized Aluminum, Mica, Thermalsil, Beryllium Oxide Ceramic |
High dielectric strength. For applications involving high frequency or high pulse rate circuitry, the inherent low electrical capacitance prevents circuit detuning and loss of signal power. |
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High thermal conductance and a minimum breakdown voltage of 400 volts DC through two layers of hard anodized coating. |
provide high maximum operating temperatures (550°C) and excellent electrical properties. |
Electrically-isolating interface material composed of silicone elastomer binder with a thermally conductive filler. Reinforced with glass cloth. |
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Sil-Free™ , Ther-O-Link, Ultrastick, Thermalcote™ |
Sil-Free™ , Ther-O-Link, Ultrastick, Thermalcote™ |
Kon Dux for use with small, discrete semiconductors. Grafoil Conducta-Pad for TO-3,TO-218,TO-220, and Multiwatt case styles. |
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Thicker than double-sided tapes, but can be provided without adhesive. Electrically conductive or isolating. In-Sil-8, T-gard™, Thermalsil™ III |
Material designed to fill gaps between hot components and their heat sinks or enclosure (plastic or metal). |
Tape
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Double-sided thermal tapes adhere the heat sink to the device and offer good thermal characteristics. Easy to apply, no curing time, electrically conductive or isolating, and need no mechanical support to provide thermal or physical contact between the device and the heat sink. |