Heat Sinks by Product Line
 North American Extrusion follows Aluminum Association Standards. Find the right extrusion from the many profiles available. We have over 900 extrusions online! |
 Clip and rail thermal solutions for power transistors. A high performance, low cost way to eliminate mounting holes, screws, rivets, and thermal inefficiency. |
 Bonded Fin technologies cool high power applications with high fin densities unavailable in extrusions. |
 For high heat concentrations, HiContact™ assemblies offer a cost effective method of cooling. |
 Solutions for heat transport, spreading, or weight savings. |
 Folded Fin technology adds surface area to cool high power applications in a lightweight package. Folded fin assemblies offer maximum forced air cooling in a minimum volume. |
 Custom designed thermal solutions using quadrant extrusions to cool high power applications. |
Heatsinks by Device Cooled
 Off-the-shelf cooling solutions for electrical packages, such as TO-220, TO-3, DIP, and many others. Copper and aluminum heat sinks. |
 A family of BGA heat sinks offers a wide range of cooling solutions for motherboard, video card, and networking applications. |
 Complete cooling solutions are available for popular microprocessors, including interface material and attachment methods. Copper Cpu heat sinks available. |
 Heat sinks designed to match popular DC to DC converter packages, extending their life and performance. |
 Cap Coolers improve the performance and extend the life of 3" diameter electrolytic capacitors. |
 Choose from several options for cooling IGBT modules - cold plates, extrusions, bonded fin, and fan heat sinks. |
 Aavid's wide selection of standard heat sinks provides easy, fast access to cooling solutions for the new generation of LED light sources from Lumileds™. |
Tape Attachments
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Double-sided thermal tapes adhere the heat sink to the device and offer good thermal characteristics. Easy to apply, no curing time, electrically conductive or isolating, and need no mechanical support to provide thermal or physical contact between the device and the heat sink. |
Semiconductor Mounting
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Factory installed. Secure the heat sinks to semiconductors via machine screws or nuts. Used with most JEDEC case sizes. |
A single screw mounts the transistor to the heat sink. Permanently presses into the heat sink. Variety of English and Metric threads. |
Permanently swaged into the heat sink. The device is placed over the stud(s) followed by the lock washer and nut. The entire component is then dropped into plated-thru holes in the PC board. |
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Can be factory installed to practically every board-mountable heat sink and flat sided extrusion. |
Permanently swaged into the heat sink. The device is mounted to the heat sink with screws installed from the top, and the entire component is dropped into the plated-thru hole in the PC board. |
Available as options on certain vertical and board mount heat sinks for mounting semiconductors. |
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One-piece stainless steel clips insert into predetermined positions. Designed to correspond to a particular heat sink. |
Factory applied. Eliminate the need to use screws and nuts in assembling the heat sink and transistor. They have an internal tab to secure the transistor permanently in place. |
Attachments - Board Level
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Factory applied only. Solid, tin plated pins support extruded heat sinks on the board for wave soldering. |
Factory applied only. Designed to easily snap into any 0.093 inch diameter PC Board hole. |
Heat sinks ordered with solderable mounting tabs have tin-plated spring steel tabs permanantly locked onto the heat sink to provide wave solderability. Mounted on the heat sink after anodizing. |
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Factory applied. For solder mounting into the PC board. Both vertical and horizontal mounting. Available in a variety of lengths, widths, and thickness. |
Factory installed to practically every board-mountable heat sink and flat sided extrusion. |
Interface Materials
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Thermalfilm, Thermalfilm MT. Low cost polymide plastic insulating films designed to be an improved replacement for mica. Radiation resistant, no melting points, no known organic solvents. |
Insulating covers, Bushings, Aluminum Oxide Ceramic, Hard Anodized Aluminum, Mica, Thermalsil, Beryllium Oxide Ceramic |
High dielectric strength. For applications involving high frequency or high pulse rate circuitry, the inherent low electrical capacitance prevents circuit detuning and loss of signal power. |
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High thermal conductance and a minimum breakdown voltage of 400 volts DC through two layers of hard anodized coating. |
provide high maximum operating temperatures (550°C) and excellent electrical properties. |
Electrically-isolating interface material composed of silicone elastomer binder with a thermally conductive filler. Reinforced with glass cloth. |
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Sil-Free™ , Ther-O-Link, Ultrastick, Thermalcote™ |
Sil-Free™ , Ther-O-Link, Ultrastick, Thermalcote™ |
Kon Dux for use with small, discrete semiconductors. Grafoil Conducta-Pad for TO-3,TO-218,TO-220, and Multiwatt case styles. |
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Thicker than double-sided tapes, but can be provided without adhesive. Electrically conductive or isolating. In-Sil-8, T-gard™, Thermalsil™ III |
Material designed to fill gaps between hot components and their heat sinks or enclosure (plastic or metal). |
Accessories
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Factory applied or purchased separately. Provide cost effective solderability. |
Excellent for retrofit applications. One piece. May be heat stamped. |
Standard Clips. Thermal Clips are factory applied only. |
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Polyphenylene Sulfide PPS and Nylon |
Pre-packaged in heat-sealed plastic bags. Variety of insulators to select from. |
Prevent heat damage during soldering. Facilitate board clean-up. Prevent solder bridges. Assure uniform device height. |
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Provides stable mount to resist shock and vibration damage to leads. |