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Search by part #     Check distributor   part inventory    Browse Heat sinks   - By Device - Ball Grid Arrays Board Level DC-to-DC Converters Electrolytic Capacitors IGBT Modules LED Light Sources Microprocessors Surface Mount   - By Product Line - Bonded Fin Extrusion Profiles Folded Fin Forced Convection Heat Pipe Assemblies Liquid Cold Plates Max Clip System Polar Cap Coolers Standard Board Level   -Attachment Methods- Max Clips Microprocessor PC Board Mounting Semiconductor Ther-A-Grip   - Interface Materials - Double Sided Tapes Epoxies Gap Fillers Greases Insulating Films Insulating Pads Insulators Thin Films   - Accessories - Alignment Pads Card Ejectors Card Guides Clips Insulators Insulating Washers Mounting Kits Mounting Pads Stanchion Pads   Useful Links  • Building a part #  • Catalog Request  • Directions  • Find Distributor  • Find Sales Rep  • How to order?  • MSDS Safety Sheets  • Part # Cross Ref  • Quote Request  • RoHS Initiative  • Sample Request		Products / BGA / Radial Fins Radial Fin Heat Sinks for Microprocessors Bond-on heat sinks for leadless chip carriers and flat packs. Primarily designed for 68-position devices. The 2283 is ideally suited to limited board space applications with high air flow. Part Number: 2283BG Part Number: 2286BG< Part Number: 2288BG Part Number: 2292BG Part Number: 2296BG

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