For Use With the Pentium® II Xeon Processors This standard heat sink is for airflow in systems
based on Intel-referenced designs, such as the
Marlin/Spike motherboard.
Features and Benefits
- Allows custom modifications
to accommodate future Xeon
speeds
- High Aspect Ratio Extrusion for Maximum Surface Area
- Provides system-level thermal
optimization and robust
mechanical attachment to the
processor cartridge and
motherboard
- Includes phase-change
interface material for optimum
performance
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Mechanical Drawing:

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Performance Graph:

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| Pentium® II is a registered trademark of Intel, Corp. Xeon is a trademark of Intel, Corp. |