Thermal Performance

Features Optimized design and robust construction focuses on rapid heat removal from the chip using heat pipes, copper, and aluminum geometries This design was developed using an overall system analysis with standard component layout and requirements. This solution met all of the parameters regarding the standard server architecture and allowed for overall system cooling to be achieved The new LGA1366 package requires the dynamic heat sink loading to be controlled to achieve proper electrical interconnect over long term reliability. These requirements have been achieved with our product

Specifications Application: Xeon 5500 series for mainstream PCs Compatibility: X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, E5502 Socket Type: LGA 1366 Construction - Base: Aluminum w/ Advanced Hi-ContactTM Heat Pipes Construction - Fins: Aluminum Zipper Fin Thermal Interface Material: Shin-Etsu G751Grease Weight: 404 Grams Mechanical: Designed to meet Intel shock and vibration requirements

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