Thermal Performance

Features Optimized design and robust construction focuses on rapid heat removal from the chip using heat pipes, copper, and aluminum geometries This design was developed using an overall system analysis with standard component layout and requirements. This solution met all of the parameters regarding the standard server architecture and allowed for overall system cooling to be achieved The new LGA1366 package requires the dynamic heat sink lodaing to be controlled to achieve proper electrical interconnect over long term reliability. These requirements have been achieved with our product

Specifications Application: Xeon 5500 and 3000 series for mainstream servers Compatibility: X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, E5502 L5520, L5506,W5580,W3570,W3540,W3520 Socket Type: LGA 1366 Construction - Base: Aluminum Base, Copper Plate w/ Heat Pipes Construction - Fins: Aluminum Zipper Fins Construction - Heat pipes: 2 Copper Heat Pipes Thermal Interface Material: Shin-Etsu G751Grease Weight: 284 Grams Dimensions: 89.75 x 98 mm Finish: Wash Mechanical: Designed to meet Intel shock and vibration requirements

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