Thermal Performance

Features Optimized design and robust construction focuses on rapid heat removal from the chip using heat pipes, copper, and aluminum geometries This design was developed using an overall system analysis with standard component layout and requirements. This solution met all of the parameters regarding the standard server architecture and allowed for overall system cooling to be achieved The new LGA1366 package requires the dynamic heat sink loading to be controlled to achieve proper electrical interconnect over long term reliability. These requirements have been achieved with our product

Specifications Application: Intel Xeon 5500 series Compatibility: X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506 Socket Type: LGA 1366 Construction - Base: Aluminum Construction - Fins: Aluminum Construction - Heat Pipe: Copper Thermal Interface Material: Shin-Etsu G751Grease Weight: 413.6 Grams Dimensions: 89.7 x 54 mm Finish: AavSHIELD3C Mechanical: Designed to meet Intel shock and vibration requirements

Fan Specifications Fan Dimmensions: 60 x 60 x 25 Fan Speed: 9000 ± 10% RPM Operation Voltage: 10.8-13.2 VDC Acoustical Noise: 55dB-A Avg Life Expectation: 70k hrs @ 40°C Bearing Type: Two Ball Bearings Housing: Molex 47054-1000 or equivelent Pin1: Black (-) Pin2: Yellow (+) Pin3: Green (Foo) Pin4: Blue (PWM)

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