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Products / Microprocessors / Notebook Assemblies / Design Considerations |
Design Considerations
Planning for thermal issues at the beginning of the design cycle is the best way to achieve the most effective cooling for your notebook computer design. |
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Icepak CFD (computational fluid dynamics) software provides a quick, accurate picture of the thermal behavior of a proposed notebook design — before it is manufactured. Thermal modeling software allows a designer to try-out different configurations, easily and rapidly, so that the design can be optimized for thermal performance without the need for expensive prototypes. |
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| Step 1 Layout Often the most effective and least expensive cooling strategy is careful component placement. Keeping hot components in the air stream and keeping the heat-sensitive hard drives away from the processor helps keep system heat within acceptable limits. |
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| Step 2 CPU The CPU generates most of the heat in a notebook PC, so it is extremely important to identify space requirements for the vents, fans, and heat sinks needed to cool the CPU. |
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| Step 3 Chipsets Because chipsets and memory must be cooled by the heat sink, exact modeling is necessary to identify the combined heating effects of multiple components. |
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| Step 4 Peripherals Since the notebook is a closed system, thermal analysis also includes the HDD, CDROM, DC-DC converter, and the battery. Proper management of the entire system affects the final heat sink assembly design. |
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| Step 5 System Analysis Up front analysis of the thermal behavior of the notebook system working as a whole reduces the design cycle time and often eliminates costly prototypes. |
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| Step 6 Rapid Prototyping To get your parts as quickly as you need to meet time-to-market demands, Aavid Thermalloy offers preassembly of the notebook solution, using epoxy or solder. We have in-house plastics capability to provide solutions for mechanical stability. |
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