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Products / Microprocessors / Notebook Assemblies / Technologies Used |
Technologies Used
The unique cooling constraints of notebook computers require specific technologies such as heat sinks, thermal interface materials, and specialized heat pipes. Frequently the ideal thermal solution is made up of several components working as a thermal network to dissipate unwanted heat. |
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Heat Sinks Extruded and folded fin heat sinks efficiently remove heat from the notebook assembly. Used in conjunction with proper design and fan selection, these heat sinks allow the optimum thermal performance. |
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| Thermal Network Low durometer interface material makes contact with the CPU module and transfers the heat to the heat sink. A fan moves the heat outside the system - 70% of the total heat dissipates this way. An aluminum plate absorbs the remaining 30% of the heat and transfers it internally to the keyboard and other components. Optimal placement of the vent and fan add to the effectiveness of the thermal performance. |
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| Heat Pipes Aavid Thermalloy offers heat pipes in custom shapes with performance in mind. Each bend or flattening operation reduces the performance of a heat pipe by up to 15%. For the right diameter and the best geometry, contact Aavid Thermalloy's Applications Engineering Department. |
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