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Products / Interface Materials / Films

Thin Films
Kon DuxRoHS Compliant!
GrafoilTM Conducta-Pad™RoHS Compliant!

Kon Dux
Standard Device Types
Kon-Dux interface pads are a cost-effective alternative to thermally conductive grease compounds. Aavid pre-applies Kon-Dux to your heat sink to enhance heat conductance from the semiconductor case and speed your manufacturing process. Kon-Dux pads are the equivalent of SoftfaceTM for low-volume applications. This material is ideal for use with small, discrete semiconductors. Kon Dux

Color Black (Metallic)
Thickness
0.005 inch
(0.13 mm)
Thermal
Impedance
0.08 °C-in2/W
Electrical
Resistivity
15 x 10-6 Ohms
Compression Strength:
for 10% reduction in thickness
580 psi
Tensile Strength 650 psi
Ultimate Compression
Strength
12500 psi
Service Temperature -240°C to +300°C
Liner None


GrafoilTM Conducta-Pad

RoHS Compliant!

GrafoilTM is a non-insulating material which reduces interface thermal resistance in a bare joint application. A dry material, basically a graphite compound, GrafoilTM was originally developed for high temperature gasketing applications and is covered by U.S. Patent 3,404,061 granted to Union Carbide. Basic shapes in stock are designed to accomodate TO-3,TO-218,TO-220, and Multiwatt case styles.GrafoilTM is factory applied to the heat sink and is available on all stamped and extruded models.






Ordering Information

Suffix Device Figure "A" Dim "B" Dim "C" Dim "D" Dim "E" Dim "F" Dim
G1 TO-3 A
G4 TO-218 B 19.30 (0.760) 4.83 (0.190) 7.87 (0.310) 15.75 (0.620) 3.81 (0.150) 0.13 (0.005)
G5 TO-220 B 16.51 (0.650) 3.43 (0.135) 5.33 (0.210) 10.67 (0.420) 3.43 (0.135) 0.13 (0.005)
G7 Multiwatt B 17.53 (0.690) 2.92 (0.115) 10.03 (0.395) 20.07 (0.790) 3.81 (0.150) 0.13 (0.005)
Note: Tolerances +/- .25mm (.010") unless otherwise specified.
Material is nylon 6/6 rated 94 V-O








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