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Kon DuxRoHS Compliant! GrafoilTM Conducta-PadRoHS Compliant!
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Kon Dux Standard Device Types
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Kon-Dux interface pads are a cost-effective alternative
to thermally conductive grease compounds. Aavid
pre-applies Kon-Dux to your heat sink to enhance heat
conductance from the semiconductor case and speed your
manufacturing process. Kon-Dux pads are the equivalent of
SoftfaceTM for low-volume applications. This material is ideal for use
with small, discrete semiconductors.
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| Color |
Black (Metallic) |
Thickness
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0.005 inch (0.13 mm) |
Thermal Impedance |
0.08 °C-in2/W |
Electrical Resistivity |
15 x 10-6 Ohms
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Compression Strength: for 10% reduction in thickness |
580 psi |
| Tensile Strength |
650 psi |
Ultimate Compression Strength |
12500 psi |
| Service Temperature |
-240°C to +300°C |
| Liner |
None |
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RoHS Compliant! GrafoilTM is a non-insulating material which
reduces interface thermal resistance in a
bare joint application. A dry material, basically
a graphite compound, GrafoilTM was originally
developed for high temperature gasketing
applications and is covered by U.S.
Patent 3,404,061 granted to Union Carbide.
Basic shapes in stock are designed to accomodate
TO-3,TO-218,TO-220, and Multiwatt
case styles.GrafoilTM is factory applied to the
heat sink and is available on all stamped and
extruded models.
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Ordering Information 
| Suffix |
Device |
Figure |
"A" Dim |
"B" Dim |
"C" Dim |
"D" Dim |
"E" Dim |
"F" Dim |
| G1 |
TO-3 |
A |
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| G4 |
TO-218 |
B |
19.30 (0.760) |
4.83 (0.190) |
7.87 (0.310) |
15.75 (0.620) |
3.81 (0.150) |
0.13 (0.005) |
| G5 |
TO-220 |
B |
16.51 (0.650) |
3.43 (0.135) |
5.33 (0.210) |
10.67 (0.420) |
3.43 (0.135) |
0.13 (0.005) |
| G7 |
Multiwatt |
B |
17.53 (0.690) |
2.92 (0.115) |
10.03 (0.395) |
20.07 (0.790) |
3.81 (0.150) |
0.13 (0.005) |
Note: Tolerances +/- .25mm (.010") unless otherwise specified. Material is nylon 6/6 rated 94 V-O
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