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Microprocessor Clips Sink-to -Socket Sink-to -CPU Sink-to -Clip
Sink-to-Socket
This family of clips has been designed to provide the maximum amount of pressure (essential for effective heat transfer) for a heat sink/CPU/socket assembly. This is especially important for large heat sinks or high shock and vibration environments. Each clip applies pressure at two points and when used as a pair, four pressure points surround the center of the CPU, improving heat transfer. Inquiries for custom design are invited.
Sink-to-CPU
This series of clips is used to fasten heat sinks directly to the PGA packages which are either socketed or mounted directly to the board. Two force series are available. The low force version is designed for low power devices while the high force series is designed for rugged shock and vibration environments and/or high watt density applications.
Sink-to-Clip
This series of clips is used to fasten heat sinks directly to the PGA package. These clips may be used on PGA packages which are either socketed or mounted directly to the board. Two force series are available. The low force version is designed for low power devices while the high force series is designed for rugged shock and vibration environments and/or high watt density applications.