Heat Sink Solutions
Natural Convection
Stamped Heat Sinks
Extruded Heat Sinks
Forced Convection
High Fin Density
Fan Heat sinks
Fluid Phase Change
Small Heatpipes
Large Heatpipes
Liquid Cooled
Liquid Cold Plates
Extended Surface
Natural Convection
Stamped Heat Sinks
Extruded Heat Sinks
Forced Convection
High Fin Density
Fan Heat sinks
Fluid Phase Change
Small Heatpipes
Large Heatpipes
Liquid Cooled
Liquid Cold Plates
Extended Surface
Stamped Heat Sink Solutions
For low power board level cooling
![]() SMT Power Semiconductors |
![]() Thru-Hole Power Semiconductors |
![]() Dual Inline Packages |
![]() Axial Lead Components |
Stamped Heat Sinks provide an economical solution to low power density thermal problems in natural convection environments. Produced using high volume manufacturing techniques to ensure the lowest cost, copper or aluminum sheet metal is stamped into a desired shape. Attachment features and interface materials can easily be added during the manufacturing process, simplifying the bill of materials and reducing assembly costs.
Why Use Aavid Stamped Heat Sinks?
- Lowest cost thermal solutions
- Ideal for Printed Circuit Boards with tight component spacing
- Readily available from Aavid and its authorized distributors
- Variety of attachment methods and accessories to simplify assembly and reduce cost
- Several surface finishes to enhance durability and cooling efficiency




