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Technical Papers |
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July 2007 Read about the latest cooling technologies for high heat flux applications in this paper given by Aavid's chief technology officer Sukhvinder Kang at InterPACK 2007 in Vancouver. CLOSED LOOP LIQUID COOLING FOR HIGH PERFORMANCE COMPUTER SYSTEMS Paper (PDF)
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April 2003 Learn about some of the latest cooling solutions offered by Aavid Thermalloy for all new modules with high power density. Comparative Analysis of Various Heatsink Technologies in Forced Ventilation 2.6 mb Paper (PDF)
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| Analytical Model for Simulating the Thermal Behavior of Microelectronic Systems 361k Abstract (HTML) Paper (PDF)
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| Analytical Modeling of Thermal Resistance in Bolted Joints 267k Abstract (HTML) Paper (PDF)
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| Closed-Form Equation for Thermal Constriction/Spreading Resistances with Variable Resistance Boundary Condition 367k Abstract (HTML) Paper (PDF)
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| Constriction/Spreading Resistance Model for Electronics Packaging 425k Abstract (HTML) Paper (PDF)
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| How to Select a Heat Sink 212k Abstract (HTML) Paper (PDF)
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| Optimum Design and Selection of Heat Sinks 249k Abstract (HTML) Paper (PDF)
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| Thermal Modeling of Isothermal Cuboids and Rectangular Heat Sinks Cooled by Natural Convection 316k Abstract (HTML) Paper (PDF)
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| Thermal Performance of an Elliptical Pin Fin Heat Sink 317k Abstract (HTML) Paper (PDF)
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| Thermal Performance of Interface Material in Microelectronics Packaging Applications Abstract (HTML) Paper (PDF)
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| Thermal Performance Modeling and Measurements of Localized Water Cooled Cold Plate 419k Abstract (HTML) Paper (PDF) |
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Augmentation Improves Thermal Performance of Air Cooled Heat Sinks |
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Augmented-Fin Air-Cooled Heat Sinks Achieve Higher Performance Without Significant Rise in Static Pressure Drop |
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As Cool as a Cucumber—Managing the Heat Produced by IC Developments |
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Beat the Heat in Notebooks—with Software |
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How to Size Heat Sinks for Semiconductors |
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Larger Packages Fuel Thermal Strategies |
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Miniaturization of Cooling Solutions |
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The Basics of Package/Device Cooling— Various Cooling Methods are Available for Keeping Electronic Devices Within Their Operating Temperature Specifications. |
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Thermal Management of Electrolytic Capacitors |
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The Thermal Side of 64-bit Processing |
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