The plates are assumed to have perfectly flat and smooth surfaces, and they are joined by a bolted connection at the center of the square, forming a concentric annular contact region at the interface.

The entire surface area of the plates are insulated, except for the surfaces where the heat source/sink is applied and where the interfacial contact is formed.

The heat flows from one edge of a plate to the opposite edge of the other plate through the contact area. The results are presented over a wide range of variables commonly found in most electronic packaging applications.

Comparisons with published numerical results show excellent agreement, and satisfactory to good agreement is obtained between the analytical predictions and experimental data.