The model provides a dynamic blending of two limiting solutions for two-dimensional, free convection channel flow, namely, a fully developed solution and an isolated plate solution.

The effects of flow impediments, such as electro-magnetic containment screens, flow deflectors and baffles, on heat transfer within the module are incorporated to provide a better representation of practical applications.

The solution procedure includes an implicit formulation for determining the heat transfer between channels based on local thermophysical characteristics, the contact resistance between the heat sources and the printed circuit boards, and flow conditions.

Results from the analytical models show good agreement with solutions and experimental data published in the open literature for a single channel with an uniform heat flux at each wall.