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Thermal Performance Modeling
and Measurements of Localized
Water Cooled Cold Plate


Abstract
Two different water-cooled cold plate designs to handle highly localized heat dissipations in electronic packaging applications are introduced.

One design employs drilled holes as the flow conduit, and the other uses a specially formed copper tube.

These designs offer high thermal performance at low water flow and pressure drop requirements.

Measurements and models for thermal and hydraulic performance are presented.

The model predictions and the measurements are in excellent agreement.


Download complete article as pdf






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